gc_kaavaali
12-28 06:15 PM
Hi logiclife,
Are you suggesting to be on H1 if you don't complete 6 years? In my case i have been on h1 for 4.5 years....i have EAD....I may use EAD because if my 485 rejected then i can fall back on H1 (by going out of country or something else)...
I dont think that after using H1 for 6 years, you can switch to H1 status from EAD status once 485 is rejected. Now, if you have used less than 6 years of H1, and then used AC21 portability, used EAD, abandoned H1 status and continued on EAD status and if the 485 gets rejected, there may be a way to reclaim the remaining unused portion of H1. It may involve going out of country and coming back in. Check with a lawyer, I dont know much and haven seen any case where someone who was on EAD status could go back to H1 status. Usually H1 to EAD is a one-way street, especially if you have already used up the 6 years of H1 stay in country.
Are you suggesting to be on H1 if you don't complete 6 years? In my case i have been on h1 for 4.5 years....i have EAD....I may use EAD because if my 485 rejected then i can fall back on H1 (by going out of country or something else)...
I dont think that after using H1 for 6 years, you can switch to H1 status from EAD status once 485 is rejected. Now, if you have used less than 6 years of H1, and then used AC21 portability, used EAD, abandoned H1 status and continued on EAD status and if the 485 gets rejected, there may be a way to reclaim the remaining unused portion of H1. It may involve going out of country and coming back in. Check with a lawyer, I dont know much and haven seen any case where someone who was on EAD status could go back to H1 status. Usually H1 to EAD is a one-way street, especially if you have already used up the 6 years of H1 stay in country.
wallpaper 10quot; Light Blonde Hair
GCaspirations
10-02 12:55 PM
NSC->CSC->NSC for 485
EAD/AP by CSC.
any idea on what are the processing dates for EAD and AP at CSC
and also finger printing timelines
Reading the forum I understand that EAD/AP approvals are coming fast from CSC.
I have not seen anyone posting about receiving finger Print notice if the case has been tansferred back to NSC from CSC.
This is the trend I have seen so far.
Anyone who has received FP notice if ur case has transferred from NSC to CSC and back to NSC - Please post.
EAD/AP by CSC.
any idea on what are the processing dates for EAD and AP at CSC
and also finger printing timelines
Reading the forum I understand that EAD/AP approvals are coming fast from CSC.
I have not seen anyone posting about receiving finger Print notice if the case has been tansferred back to NSC from CSC.
This is the trend I have seen so far.
Anyone who has received FP notice if ur case has transferred from NSC to CSC and back to NSC - Please post.
actaccord
01-31 08:56 AM
to find anything related to the patent in uspto.gov
Ms Su of TVU....why would someone stoop so low and looks like she became a convenient scapegoat for the students ..? not sure what'd you think. She has a Phd from UC Berkley and a patent on her name ....several publications.
I dug up her resume...
Dr. Susan Xiao-Ping Su
President of Tri-Valley University
Tri-Valley University TVU (http://trivalleyuniversity.org)
E-mail: ssu@trivalleyuniversity.org, su123@sbcglobal.net
EDUCATION
Ph .D. Department of Mechanical Engineering, University of California at Berkeley, 2001.
Major: Design; Minor I: Microscale Heat Transfer; Minor II: Integrated Circuit Technology.
Dissertation: Compliant Microleverage Mechanism Design for MEMS Application
Dissertation Advisors: Prof. Alice M. Agogino; Prof. Tsu-Jae King, Prof. Dennise K. Lieu
M. S. Department of Mechanical and Aeronautical Engineering, University of California at Davis, 1997. Major: Design
Thesis: Computer-Aided Kinematic and Dynamic Analysis of Spatial Mechanisms
Thesis Advisors: Prof. Harry H. Cheng; Prof. Bahram Ravani; Prof. An T. Yang (Emeritus)
B. S. Department of Engineering Mechanics, Tsinghua University, China, 1991.
Major Field of Study: Fluid Mechanics
WORK EXPERIENCE
1. President and Founder, Semiconductor System Integration, Pleasanton, 2003-present
� Consultant for Phosistor Technology, Pleasanton, on Semiconductor Device Fabrication, Development of photonic component (laser and OPM) process, Oxford Plasmalab DRIE and ICP etching of SiO2 for Optical MEMS devices.
� Consultant for California Micro Device on Chip-Scale-Packaging strengthen mechanism;
� Consultant for NASA on nano chemical sensor fabrication.
� High-density Magnetic Random Access Memory Development
2. Lecturer, HerGuan University, Sunnyvale, 2007
EE537 Analog IC Design, EE515 & 516 VLSI I & II
3. Lecturer, San Jose State University, San Jose, CA, Fall 2004-2006
EE178 Digital System Design with FPGA, ME 101 Dynamic
4. Lecturer, San Francisco State University, San Francisco, CA, 2004-2005;
ENGR 890 Design of MEMS; Design of CMOS Memory Circuit
ENGR 356 Computer Architecture; ENGR378 Digital System Design with Verilog.
5. Lecturer, International Technological University, Santa Clara, CA, 2004-2007
EEN967 Analog IC Design; EE 519 CMOS Memory Circuit Design; EE 511 VlSI I, II;
EEN 923 & 910 Semiconductor Physics & Devices; EEN 918 IC Fabrication Technology.
6. Lecturer, Northwestern Polytechnic University, Fremont, CA, 9/2002 -2004
EE 507 Analog IC Design; EE 520 CMOS Memory Circuit Design;
EE 506 VLSI II; EE 624 IC Fabrication Technology; EE 581 MEMS/NEMS Design;
Developing MEMS and nanotechnology concentration area curriculum.
7. Member of Technical Staff, Project manager, PicoNetics Inc., Fremont, 9/2000-9/2002.
� 256K 100MHz (TSMC 0.25m) and 4M 200MHz SRAM design (0.13m G logic process); RLC circuit for on-chip sin wave generation, sense amplifier fro SRAM, DRAM, Bandgap reference, voltage regulator, PLL circuit design, standard cell library design.
� Supervision of two layout engineers for a 256K SRAM circuit including all technical file set-up, layout optimization for minimum coupling and RC delay, Dracula LVS and Arcadia extraction, LVS and Extraction tools evaluation and memory compliers; UMC and TSMC 0.25, 0.18, 0.15 and 0.13 m process evaluation for SRAM.
8. Graduate Researcher, Berkeley Sensor and Actuator Center (BSAC), and Berkeley Expert Technology System Lab (BEST), U. C. Berkeley, 1996-2000.
� Design, fabrication and testing of a resonant accelerometer (RXL) with on-chip amplifier and two-stage leverage mechanism by the SOI-MEMS integrated process.
� Compliant micro-leverage mechanism design and analysis, FEM analysis and simulation with ABAQUS and SUGAR; Design of the mechanism for force and displacement amplification in other MEMS devices including a micro-valve, an electrostatic actuator and the suspension of the disk drive.
9. Internship, Lawrence Berkeley National Lab, EETD, 6/1999-12/1999.
� Optics programming; SEM and TEM measurements of glass samples.
10. Graduate Researcher, Integrated Engineering and Mechatronics Lab, Dept. of Mechanical and Aeronautical Engineering, UC Davis, 1994-1996
� With Ch program, analysis of velocity and acceleration for 32 spatial mechanisms (4-bar, 5-bar, 6-bar and 7-bar); force and torque analysis of RCCC & RCRCR mechanisms;
� Designed a data acquisition system for PAS machine by communication of an AT-MIO-16F board in Labview.
GRADUATE THESIS ADVISING:
� Yaosong Tao, International Technological University, Ph.D. Thesis: RF MEMS Components for Communication Systems, 2004.
� Leo Huang, Northwestern Polytechnic University, M.S. Thesis, Contacting Printing Lithography for Polymeric Organic Light-Emitting Diode, 2005;
� Sam Shi, International Technological University, M.S. Thesis, A 8-bit Energy Recover Adder, 2005;
� Parthiv Pandya, International Technological University, M.S. Thesis: MRAM Core Cell Design and Optimization, 2004;
� Paisit Sriprataks, International Technological University, M.S. Thesis: MRAM Sensing Circuit Design, 2004;
� Balajee Premraj, International Technological University, M.S. Thesis: Design of an 8M MRAM, 2004;
� Raul Gali, Northwestern Polytechnic University, M.S. Thesis: Signal Process Circuit Design for a Resonant Accelerometer, 2003;
AWARDS and HONORS
� John H. Latoures Scholarship, Mechanical Engineering Department,U.C. Berkeley, 2001.
� Lankershim Awards, U.C. Berkeley, 2000
� National Science Foundation (NSF) Graduate Research Fellowship (1996-1999);
� American Associated University Woman (AAUW) Selected Professional Fellowship ,1995;
� University Fee Grant, UC Davis, 1994.
PUBLICATIONS
1. S. X. P. Su, H. S. Yang, Alice M Agogino, Resonant Accelerometer with a Two-Stage Microleverage Mechanism Fabricated by SOI-MEMS Technology, IEEE Sensors Journal, Vol.5, No.6 December 2005, p.1214-1223
2. An Sang Hou, Susan X. P. Su, Design of a Capacitive-Sensor Signal Processing System with High Accuracy and Short Conversion Time, Sensors and Actuators A: Physical, Volume 119, Issue 1, 28 March 2005, P.113-119
3. X-P S. Su, H. S. Yang, Analytical Modeling and FEM Simulation of Single-Stage Microleverage Mechanism, International Journal of Mechanical Sciences 44, 2217-2238, 2002.
4. X-P. S. Su, H. S. Yang, Two-Stage Microleverage Mechanism Optimization in a Resonant Accelerometer, Structural and Multidisciplinary Optimization 22, 328-336, 2002.
5. X-P S. Su, H. S. Yang, Design of Compliant Microleverage Mechanism, Sensors and Actuators, A 87 146-156, 2001.
6. X-P S. Su, H. S. Yang, Single-Stage Microleverage Mechanism Optimization in a Resonant Accelerometer, Structural and Multidisciplinary Optimization 21, 246-252, 2001
7. H. S. Yang, X-P S. Su and B. Bai, Strain Analysis in Uniaxial Tensile and Compression Testing of Anisotropic Materials, International Journal of Mechanical Sciences 42 (2000) 2395-2415.
PATENTS
1. Susan X. P. Su, �A Folded-MTJ MRAM Cell� U.S. Patent No. US60/994941, 2007
Ms Su of TVU....why would someone stoop so low and looks like she became a convenient scapegoat for the students ..? not sure what'd you think. She has a Phd from UC Berkley and a patent on her name ....several publications.
I dug up her resume...
Dr. Susan Xiao-Ping Su
President of Tri-Valley University
Tri-Valley University TVU (http://trivalleyuniversity.org)
E-mail: ssu@trivalleyuniversity.org, su123@sbcglobal.net
EDUCATION
Ph .D. Department of Mechanical Engineering, University of California at Berkeley, 2001.
Major: Design; Minor I: Microscale Heat Transfer; Minor II: Integrated Circuit Technology.
Dissertation: Compliant Microleverage Mechanism Design for MEMS Application
Dissertation Advisors: Prof. Alice M. Agogino; Prof. Tsu-Jae King, Prof. Dennise K. Lieu
M. S. Department of Mechanical and Aeronautical Engineering, University of California at Davis, 1997. Major: Design
Thesis: Computer-Aided Kinematic and Dynamic Analysis of Spatial Mechanisms
Thesis Advisors: Prof. Harry H. Cheng; Prof. Bahram Ravani; Prof. An T. Yang (Emeritus)
B. S. Department of Engineering Mechanics, Tsinghua University, China, 1991.
Major Field of Study: Fluid Mechanics
WORK EXPERIENCE
1. President and Founder, Semiconductor System Integration, Pleasanton, 2003-present
� Consultant for Phosistor Technology, Pleasanton, on Semiconductor Device Fabrication, Development of photonic component (laser and OPM) process, Oxford Plasmalab DRIE and ICP etching of SiO2 for Optical MEMS devices.
� Consultant for California Micro Device on Chip-Scale-Packaging strengthen mechanism;
� Consultant for NASA on nano chemical sensor fabrication.
� High-density Magnetic Random Access Memory Development
2. Lecturer, HerGuan University, Sunnyvale, 2007
EE537 Analog IC Design, EE515 & 516 VLSI I & II
3. Lecturer, San Jose State University, San Jose, CA, Fall 2004-2006
EE178 Digital System Design with FPGA, ME 101 Dynamic
4. Lecturer, San Francisco State University, San Francisco, CA, 2004-2005;
ENGR 890 Design of MEMS; Design of CMOS Memory Circuit
ENGR 356 Computer Architecture; ENGR378 Digital System Design with Verilog.
5. Lecturer, International Technological University, Santa Clara, CA, 2004-2007
EEN967 Analog IC Design; EE 519 CMOS Memory Circuit Design; EE 511 VlSI I, II;
EEN 923 & 910 Semiconductor Physics & Devices; EEN 918 IC Fabrication Technology.
6. Lecturer, Northwestern Polytechnic University, Fremont, CA, 9/2002 -2004
EE 507 Analog IC Design; EE 520 CMOS Memory Circuit Design;
EE 506 VLSI II; EE 624 IC Fabrication Technology; EE 581 MEMS/NEMS Design;
Developing MEMS and nanotechnology concentration area curriculum.
7. Member of Technical Staff, Project manager, PicoNetics Inc., Fremont, 9/2000-9/2002.
� 256K 100MHz (TSMC 0.25m) and 4M 200MHz SRAM design (0.13m G logic process); RLC circuit for on-chip sin wave generation, sense amplifier fro SRAM, DRAM, Bandgap reference, voltage regulator, PLL circuit design, standard cell library design.
� Supervision of two layout engineers for a 256K SRAM circuit including all technical file set-up, layout optimization for minimum coupling and RC delay, Dracula LVS and Arcadia extraction, LVS and Extraction tools evaluation and memory compliers; UMC and TSMC 0.25, 0.18, 0.15 and 0.13 m process evaluation for SRAM.
8. Graduate Researcher, Berkeley Sensor and Actuator Center (BSAC), and Berkeley Expert Technology System Lab (BEST), U. C. Berkeley, 1996-2000.
� Design, fabrication and testing of a resonant accelerometer (RXL) with on-chip amplifier and two-stage leverage mechanism by the SOI-MEMS integrated process.
� Compliant micro-leverage mechanism design and analysis, FEM analysis and simulation with ABAQUS and SUGAR; Design of the mechanism for force and displacement amplification in other MEMS devices including a micro-valve, an electrostatic actuator and the suspension of the disk drive.
9. Internship, Lawrence Berkeley National Lab, EETD, 6/1999-12/1999.
� Optics programming; SEM and TEM measurements of glass samples.
10. Graduate Researcher, Integrated Engineering and Mechatronics Lab, Dept. of Mechanical and Aeronautical Engineering, UC Davis, 1994-1996
� With Ch program, analysis of velocity and acceleration for 32 spatial mechanisms (4-bar, 5-bar, 6-bar and 7-bar); force and torque analysis of RCCC & RCRCR mechanisms;
� Designed a data acquisition system for PAS machine by communication of an AT-MIO-16F board in Labview.
GRADUATE THESIS ADVISING:
� Yaosong Tao, International Technological University, Ph.D. Thesis: RF MEMS Components for Communication Systems, 2004.
� Leo Huang, Northwestern Polytechnic University, M.S. Thesis, Contacting Printing Lithography for Polymeric Organic Light-Emitting Diode, 2005;
� Sam Shi, International Technological University, M.S. Thesis, A 8-bit Energy Recover Adder, 2005;
� Parthiv Pandya, International Technological University, M.S. Thesis: MRAM Core Cell Design and Optimization, 2004;
� Paisit Sriprataks, International Technological University, M.S. Thesis: MRAM Sensing Circuit Design, 2004;
� Balajee Premraj, International Technological University, M.S. Thesis: Design of an 8M MRAM, 2004;
� Raul Gali, Northwestern Polytechnic University, M.S. Thesis: Signal Process Circuit Design for a Resonant Accelerometer, 2003;
AWARDS and HONORS
� John H. Latoures Scholarship, Mechanical Engineering Department,U.C. Berkeley, 2001.
� Lankershim Awards, U.C. Berkeley, 2000
� National Science Foundation (NSF) Graduate Research Fellowship (1996-1999);
� American Associated University Woman (AAUW) Selected Professional Fellowship ,1995;
� University Fee Grant, UC Davis, 1994.
PUBLICATIONS
1. S. X. P. Su, H. S. Yang, Alice M Agogino, Resonant Accelerometer with a Two-Stage Microleverage Mechanism Fabricated by SOI-MEMS Technology, IEEE Sensors Journal, Vol.5, No.6 December 2005, p.1214-1223
2. An Sang Hou, Susan X. P. Su, Design of a Capacitive-Sensor Signal Processing System with High Accuracy and Short Conversion Time, Sensors and Actuators A: Physical, Volume 119, Issue 1, 28 March 2005, P.113-119
3. X-P S. Su, H. S. Yang, Analytical Modeling and FEM Simulation of Single-Stage Microleverage Mechanism, International Journal of Mechanical Sciences 44, 2217-2238, 2002.
4. X-P. S. Su, H. S. Yang, Two-Stage Microleverage Mechanism Optimization in a Resonant Accelerometer, Structural and Multidisciplinary Optimization 22, 328-336, 2002.
5. X-P S. Su, H. S. Yang, Design of Compliant Microleverage Mechanism, Sensors and Actuators, A 87 146-156, 2001.
6. X-P S. Su, H. S. Yang, Single-Stage Microleverage Mechanism Optimization in a Resonant Accelerometer, Structural and Multidisciplinary Optimization 21, 246-252, 2001
7. H. S. Yang, X-P S. Su and B. Bai, Strain Analysis in Uniaxial Tensile and Compression Testing of Anisotropic Materials, International Journal of Mechanical Sciences 42 (2000) 2395-2415.
PATENTS
1. Susan X. P. Su, �A Folded-MTJ MRAM Cell� U.S. Patent No. US60/994941, 2007
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bluekayal
02-16 11:06 AM
Nandakumar,
The conference call is today. Please send me a PM. There is lots of exciting work ahead, and we need more hands!
Bluekayal
I live in south bay and would definitely like to join.
The conference call is today. Please send me a PM. There is lots of exciting work ahead, and we need more hands!
Bluekayal
I live in south bay and would definitely like to join.
more...
kirupa
02-08 08:44 PM
Wow, these have to be the best pixel art designs I have seen created. I voted for soul's because it just simple, angled. I also really liked all the things going on in eilsoe's graphic. If it wasn't for the wall eilsoe (I like cool slanted, twisted things) I would have def voted for your cool graphic. It was more of a tie between both of you guys really =)
Cheers!
Kirupa :eye:
Cheers!
Kirupa :eye:
lj_rr
08-22 11:22 AM
08/22/2007: October 2007 EB Visa Bulletin Prediction of AILA
Based on the discussion with Charlie Oppenheim, Chief of Immigrant Visa Control and Reporting, DOS, the AILA has just released the following predictions:
EB-1 (All Countries): Closely match to September 2007 VB
EB-2 (All Countries): Closely match to September 2007 VB
EB-3 (All Countries): Similar to January 2007 VB
EB-3EW (All Countries): 10/01/2001
EB-4: N/A
EB-5: C
Most of us do not have access to Aila's articles.
Based on the discussion with Charlie Oppenheim, Chief of Immigrant Visa Control and Reporting, DOS, the AILA has just released the following predictions:
EB-1 (All Countries): Closely match to September 2007 VB
EB-2 (All Countries): Closely match to September 2007 VB
EB-3 (All Countries): Similar to January 2007 VB
EB-3EW (All Countries): 10/01/2001
EB-4: N/A
EB-5: C
Most of us do not have access to Aila's articles.
more...
nozerd
04-13 11:35 AM
This basicalkly means that too many cases are stuck in name check at I 140 and I 485 stage or that USCIS is not processing as fast as it ought to.
To give you an ex I have a friend with PD of Dec 1998 (original case not substitution) whose I 485 is stuck in name check., My friend is not a Muslim. There could be many others too.
What does this mean? That there are not as many approved labor cases as anticipated originally by the USCIS????
"F. VISA AVAILABILITY DURING THE COMING MONTHS
Recent discussions have indicated that both the Citizenship and Immigration Services (CIS) and the Department of Labor still have a significant amount of cases in their backlog reduction efforts. As a result, the anticipated increase in demand has not yet materialized and may not for some time. Therefore, in an effort to maximize number use under the annual numerical limit, the Worldwide and Philippines Employment Third preference cut-off dates have been advanced by one year.
Unless there is a significant increase in Employment demand, it will be necessary to continue this rate of movement during the upcoming months. Such movement could be expanded to include other chargeability areas and preference categories.
One consequence of rapid cut-off date advancement is the inevitable increase in demand for numbers as adjustment of status cases are brought to conclusion at CIS Offices. Such increased demand could have dramatic impact on the cut-off dates. Readers will be provided as much advance notice as possible should this occur."
To give you an ex I have a friend with PD of Dec 1998 (original case not substitution) whose I 485 is stuck in name check., My friend is not a Muslim. There could be many others too.
What does this mean? That there are not as many approved labor cases as anticipated originally by the USCIS????
"F. VISA AVAILABILITY DURING THE COMING MONTHS
Recent discussions have indicated that both the Citizenship and Immigration Services (CIS) and the Department of Labor still have a significant amount of cases in their backlog reduction efforts. As a result, the anticipated increase in demand has not yet materialized and may not for some time. Therefore, in an effort to maximize number use under the annual numerical limit, the Worldwide and Philippines Employment Third preference cut-off dates have been advanced by one year.
Unless there is a significant increase in Employment demand, it will be necessary to continue this rate of movement during the upcoming months. Such movement could be expanded to include other chargeability areas and preference categories.
One consequence of rapid cut-off date advancement is the inevitable increase in demand for numbers as adjustment of status cases are brought to conclusion at CIS Offices. Such increased demand could have dramatic impact on the cut-off dates. Readers will be provided as much advance notice as possible should this occur."
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Googler
02-20 07:03 PM
http://www.aila.org/content/default.aspx?docid=24696
Thanks. The most hilarity inducing section of this Q&A is this bit:
"Q2. Why is this policy being implemented?
A2. This policy change is in response to a 2005 DHS Inspector General recommendation that USCIS
align its background check screening policies with those of U.S. Immigration and Customs Enforcement."
That is SUCH a huge whopper. :D So they waited for 3 freaking years before implementing this!
Thanks. The most hilarity inducing section of this Q&A is this bit:
"Q2. Why is this policy being implemented?
A2. This policy change is in response to a 2005 DHS Inspector General recommendation that USCIS
align its background check screening policies with those of U.S. Immigration and Customs Enforcement."
That is SUCH a huge whopper. :D So they waited for 3 freaking years before implementing this!
more...
cool_desi_gc
07-26 01:33 PM
Do we also need to include te fees for Biometrics if this is for AP renewal ? I have a valid AP till Nov 28th.I need to apply for renewal.
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ireddy
08-22 01:58 PM
They worked enough for this year and they have lot to do. According to my guess they have the following pending work.
1. Issue Receipts (Sep/October)
2. Issue EAD cards for approx 300,000 applicants? (October/November/December)
3. Issues AP for 300,000 (October/November/December)
On top of this they need to celebrate thanksgiving and christmas like every citizen. So don't expect too much from them for this year.
If at all there is some momement in EB numbers, that will happen only between Jan-March(before H1-B madness starts).
Good luck !
I think you missed a new one (in news today)
- Issue new Green Cards for 750,000 (cards without expiration dates have to be replaced)
1. Issue Receipts (Sep/October)
2. Issue EAD cards for approx 300,000 applicants? (October/November/December)
3. Issues AP for 300,000 (October/November/December)
On top of this they need to celebrate thanksgiving and christmas like every citizen. So don't expect too much from them for this year.
If at all there is some momement in EB numbers, that will happen only between Jan-March(before H1-B madness starts).
Good luck !
I think you missed a new one (in news today)
- Issue new Green Cards for 750,000 (cards without expiration dates have to be replaced)
more...
thakurrajiv
07-02 03:10 PM
My company paid for attorney fees. I dont know the amount for that.
My pocket expense
$380 - medical tests
$60 - photographs
$50 - mailing fees.
Obviously, no money can account for the mental torture I and my family have been going through once we learned about visa bulletion revision rumors.
My pocket expense
$380 - medical tests
$60 - photographs
$50 - mailing fees.
Obviously, no money can account for the mental torture I and my family have been going through once we learned about visa bulletion revision rumors.
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gk_2000
07-29 03:13 PM
You are saying that because you are from ROW.
I would be delighted since I am from EB3-I. That is what is unfair about this country cap. You probably filed your GC in 2009 and is already impatient. Think about people who came to this country in 2000 or before still waiting for their GCs.
Some of them has aging out kids who will lose their eligibility because of this long wait.
This "me vs you" attitude is what is unhealthy. Having PD of June 2002 is nothing to be happy about, either for EB3-I or ROW. It is just pathetic. We should all be together in this. Asking for more visa numbers, recapture, etc would be more practical for us
I would be delighted since I am from EB3-I. That is what is unfair about this country cap. You probably filed your GC in 2009 and is already impatient. Think about people who came to this country in 2000 or before still waiting for their GCs.
Some of them has aging out kids who will lose their eligibility because of this long wait.
This "me vs you" attitude is what is unhealthy. Having PD of June 2002 is nothing to be happy about, either for EB3-I or ROW. It is just pathetic. We should all be together in this. Asking for more visa numbers, recapture, etc would be more practical for us
more...
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kriskris
03-26 01:31 PM
I have my TX license till 06-2013. With the new rules, I heard that DMV's in Dallas are issuing vertical cards which has an expiration date of EAD/H1b expiry date. I recently moved to a new apartment. When i try to change the address online it is asking me to go the nearest DMV. I dont want to loose my current license which has expiry till 2013. Is it OK if i dont change my new address on my drivers license or is there a way to get my new card with the old expiration date. my current EAD expires on 10/2009.
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breddy2000
04-02 05:22 PM
Sent both faxes
more...
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syzygy
05-15 01:12 AM
would it even help people who did MS in stem from US university but are stuck in eb3 due to bad policies of their companies ?Or is this only for eb2 / eb1?
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Dandruff
07-29 12:02 PM
EAD Renewal / EB2-I
E-filed : 06/15/08
FP : 07/11/08
Card Production Email : 07/28/08
43 days.
will update when card is recvd re: duration
E-filed : 06/15/08
FP : 07/11/08
Card Production Email : 07/28/08
43 days.
will update when card is recvd re: duration
more...
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hpandey
12-28 12:33 PM
Anyone invoking AC21 with unapproved I-140?
If you try to use AC21 without an approved I-140 your employer can withdraw the I-140 petition ( since it is not approved yet ) . So best wait a few months until it is approved and then merrily go the AC21 way
If you try to use AC21 without an approved I-140 your employer can withdraw the I-140 petition ( since it is not approved yet ) . So best wait a few months until it is approved and then merrily go the AC21 way
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wahwah
06-05 11:33 AM
since the new supplemental memo has been issued, the rule making agenda may be pushed off. but i think the new memo will be effective immediately.
See this..from immigration-law.com
However, the release of this new supplemental AC-21 probably implies that the rule-making agenda may be pushed off and may not be enacted this year. Please stay tuned.
See this..from immigration-law.com
However, the release of this new supplemental AC-21 probably implies that the rule-making agenda may be pushed off and may not be enacted this year. Please stay tuned.
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Aah_GC
11-19 01:55 PM
RD - July 23. Haven't received FP notices for me and my wife. Received EADs. eFiled AP - got my receipt but not my wife.
mrow
06-19 07:18 PM
Thought I should share my EB-3 (horror) story:
First initiated my RIR labor in 01/2002
PD: Aug 02,2002
RD: Sept 18, 2003
Approval: June 19 2007
I765 & 131 renewed 4 times.
Though I graduated with a Masters' degree from here back in '98, I was wrongly advised by a lawyer (who I unfortunately knew) who said I did'nt meet min. salary requirements and put me in EB-3 instead of EB-2 (though all my friends who graduated with me were in EB-2 and I knew they could'nt be making a whole lot more than I was). So if your lawyer wants to put you in EB-3 even though you're eligible for EB-2 change lawyers right away; It will mean a world of difference when things go bad. Chances are, the lawyer wants minimum paperwork & hassles to deal with. To add to bad luck, I had an Indian manager who refused to pay for my green card and even the ads for RIR labor, even though he got his green card paid for. Anyways priority dates were current for all categories back then (2002-3) just like it is today when they reclaimed unused numbers so this attorney had said EB3 vs EB2 won't be a problem and convinced me to go with EB3. This 'current' situation went on for some time (a year or so perhaps(?) to 2004 or 05; I do not remember) and then the DOS went and retrogressed EB3 back to 1999! During the year or two Priority Dates were current the INS (as it was called then) took their sweet time in processing cases progressing real slow. So when they were about 3-4 months away from processing my PD and I thought I was real close to 485 approval, the DOS did their thing and retrogressed dates all the way back to 1999 and has become current only now. It hit me with a gale force effect when it retrogressed.
It's almost like things swing like a pendulum between the two departments. If you're real lucky and time it right things can go smooth. If not yes you're screwed like I was and things can go bad one after the other. This time around I was almost sure the USCIS will take a go slow policy and wait for dates to retrogress once again like the last time. I was very surprised by the HUGE movements of 485 processing dates. Things are looking far better this time with these dates. Focus on getting your EAD and Advance paroles ASAP. I-140 premium processing will be worth it. Good luck to you all.
First initiated my RIR labor in 01/2002
PD: Aug 02,2002
RD: Sept 18, 2003
Approval: June 19 2007
I765 & 131 renewed 4 times.
Though I graduated with a Masters' degree from here back in '98, I was wrongly advised by a lawyer (who I unfortunately knew) who said I did'nt meet min. salary requirements and put me in EB-3 instead of EB-2 (though all my friends who graduated with me were in EB-2 and I knew they could'nt be making a whole lot more than I was). So if your lawyer wants to put you in EB-3 even though you're eligible for EB-2 change lawyers right away; It will mean a world of difference when things go bad. Chances are, the lawyer wants minimum paperwork & hassles to deal with. To add to bad luck, I had an Indian manager who refused to pay for my green card and even the ads for RIR labor, even though he got his green card paid for. Anyways priority dates were current for all categories back then (2002-3) just like it is today when they reclaimed unused numbers so this attorney had said EB3 vs EB2 won't be a problem and convinced me to go with EB3. This 'current' situation went on for some time (a year or so perhaps(?) to 2004 or 05; I do not remember) and then the DOS went and retrogressed EB3 back to 1999! During the year or two Priority Dates were current the INS (as it was called then) took their sweet time in processing cases progressing real slow. So when they were about 3-4 months away from processing my PD and I thought I was real close to 485 approval, the DOS did their thing and retrogressed dates all the way back to 1999 and has become current only now. It hit me with a gale force effect when it retrogressed.
It's almost like things swing like a pendulum between the two departments. If you're real lucky and time it right things can go smooth. If not yes you're screwed like I was and things can go bad one after the other. This time around I was almost sure the USCIS will take a go slow policy and wait for dates to retrogress once again like the last time. I was very surprised by the HUGE movements of 485 processing dates. Things are looking far better this time with these dates. Focus on getting your EAD and Advance paroles ASAP. I-140 premium processing will be worth it. Good luck to you all.
nixstor
07-07 06:24 PM
Condi Rice burshed the question about the DOS and USCIS fiasco. Bill CLinton has rightly said recently ..Law is minor obscacle for this administration.
I missed it. Any links to the video?
I missed it. Any links to the video?